: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Home > MGP Mold >

SOT26/223/89 MGP Packaging Mold For Semiconductor Injection Molding Mold

Product Categories

Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Guangdong Taijin Semiconductor Technology Co., Ltd

Visit Website

City: Dongguan

Province/State: Guangdong

Country/Region: China

View Contact Details

SOT26/223/89 MGP Packaging Mold For Semiconductor Injection Molding Mold

Contact Now

SOT26/223/89 MGP Packaging Mold For Semiconductor Injection Molding Mold

SOT26/223/89 MGP Mold Main packaging form: To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89...

Product Tags:

Packaging Mold For Semiconductor

Semiconductor Injection Molding Mold

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Guangdong Taijin Semiconductor Technology Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!