Sign In | Join Free | My bushorchimp.com
China Guangdong Taijin Semiconductor Technology Co., Ltd logo
Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
Verified Supplier

2 Years

Home > Semiconductor Molding Equipment >

Auto Chip Encapsulation System

Guangdong Taijin Semiconductor Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
Guangdong Taijin Semiconductor Technology Co., Ltd
Visit Website
City: Dongguan
Province/State: Guangdong
Country/Region: China

Auto Chip Encapsulation System

Auto Chip Encapsulation System

Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our ...

Product Tags:

Auto Chip Encapsulation System

      

Auto Chip encapsulation equipment

      
Send your message to this supplier
 
*From:
*To: Guangdong Taijin Semiconductor Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)