: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Semi-auto molding machine

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Semi-auto molding machine

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Semi-auto molding machine

Application range: Small batch production, mold testing, laboratory, teaching instruments Main parameters: Mold clamping pressure: 98-1176kN Injection pressure: 1-29.4kN, 8-stage injection speed ...

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